Research
My research is on thermal management of high-power electronics and the systems built around them. It spans the component level, where the question is how to remove kilowatts of heat from a single chip package, and the system level, where the question is how a liquid-cooled data center behaves, how much energy its cooling consumes, and how it should be sized and operated.
Manifold microchannel cold plates for high-power GPU packages
Liquid cold plates for GPU packages that will dissipate 10 kW and more, and a design framework for manifold microchannel cold plates at large package footprints.
Thermal-hydraulic design · Design optimization · Reduced-order and data-driven modeling · Fabrication and testing
Dynamic system modeling of liquid-cooled AI data centers
How a liquid-cooled AI data center behaves in time: under changing workloads, changing weather, and at increasing scale, with single-phase and two-phase direct-to-chip cooling.
System-level modeling · Transient analysis · Energy efficiency · Heat rejection
Additively manufactured cold plates for GPUs
Cold plates printed in copper as a single part, with fin geometries that cannot be machined, characterized on a test bench and on GPU hardware.
Design for additive manufacturing · Computational fluid dynamics · Experimental characterization
Li-ion battery thermal management
Keeping lithium-ion cells in their temperature window during fast charge and discharge, by boiling a dielectric fluid on the cell and by cooling the cell from the inside.
Two-phase immersion cooling · Experimental setup design · Electro-thermal modeling
Other research
Projects outside my main research areas. Some became papers and some did not, and I learned a great deal from each.
Cryogenic and vacuum experiments · Uncertainty analysis · Experimental fluid mechanics · Machine learning
Looking ahead
Cold plate design and data center design depend on each other: the cold plate determines what a rack can dissipate, and the way the facility operates determines the conditions the cold plate has to work under. I would like to keep working across both levels in industry, in data center, semiconductor or electric vehicle thermal management. I am open to internships for summer and fall 2027, and to full-time roles from 2028.